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The Electronic and Photonic Packaging Division (EPPD) of the American Society of Mechanical Engineers cordially invites your attendance at InterPACK ’07 July 8-12, 2007. An outstanding scientific program is planned with oral presentations and poster sessions, panel sessions, tutorials, plenary sessions with keynote speakers and exhibitors displaying the latest in packaging technologies. The conference will be co-located with the ASME-JSME Thermal Engineering Conference and ASME Summer Heat Transfer Conference at the spectacular Westin Bayshore Resort and Marina in beautiful Vancouver, British Columbia, Canada. |
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Important Dates:
Abstract Submittal Deadline December 1, 2006 December 15, 2006
site will remain open for submission of late abstracts
Abstract Acceptance Notification January 15, 2007
Draft Manuscript Deadline February 16, 2007
Final Manuscript Deadline April 6, 2007
Conference July 8 – 12, 2007 |
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