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InterPACK '09
July 19-23, 2009
Westin St. Francis
San Francisco, California USA
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Come join us in beautiful San Francisco and enjoy the landmark Westin St. Francis Hotel. Situated in the heart of San Francisco in Union Square, the Westin St. Francis is one of the city’s premier hotels. Renowned for its legendary service and world-class dining, The Westin St. Francis is within walking distance is Chinatown, the Theatre District and San Francisco’s top shopping and restaurants.
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Conference Objectives
The InterPACK '09 Conference aims to promote international cooperation, understanding, and promotion of efforts and disciplines in Microelectronics, Photonics, Microwave, MEMS and NEMS- Systems Packaging and Integration. Emerging knowledge, research results, new developments, and novel thermal/mechanical/electrical/materials packaging product concepts in Electronic Packaging Engineering will be presented in unique forums and archived in electronic conference proceedings
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Technical Highlights
Technical information will be presented in unique forums and archived in electronic conference proceedings for future use and reference. This year's conference will provide a forum for exchange of information related to the following areas:
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Telecommunications
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Packaging Technology
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Electrical Design, Simulation and Test
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Microelectronic Systems
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Photonics
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Airborne, Space and Defense Electronic Systems
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Microelectromechanical Systems (MEMS) and Nanoscale Phenomena in Electronics
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